Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9935029 | Printed wiring board for package-on-package | Shigeru Yamada, Masatoshi Kunieda | 2018-04-03 |
| 9893016 | Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same | Hajime Sakamoto, Yoshinori Shizuno, Shigeru Yamada | 2018-02-13 |