Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090238 | Wiring substrate and method for manufacturing the same | Keisuke Shimizu | 2018-10-02 |
| 9893016 | Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same | Yoshinori Shizuno, Shigeru Yamada, Takashi Kariya | 2018-02-13 |