Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953945 | Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductors | Hee Jung Kim, Jung Hak Kim, Kwang Joo Lee | 2018-04-24 |
| 9905450 | Wafer processing base | Hyo Sook Joo, Suk Ky Chang, Jung Sup Shim | 2018-02-27 |
| 9868881 | Swelling tape for filling gap | Suk Ky Chang, Byung Kyu Jung, Yoon Tae Hwang, Cha Hun Ku, Sung Jong Kim +3 more | 2018-01-16 |
| 9862864 | Swelling tape for filling gap | Suk Ky Chang, Byung Kyu Jung, Yoon Tae Hwang, Cha Hun Ku, Sung Jong Kim +3 more | 2018-01-09 |