Issued Patents 2018
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141543 | Method for manufacturing electronic device | Yoon Gyung Cho, Hyun Jee Yoo, Jung Sup Shim, Seung Min Lee | 2018-11-27 |
| 10131825 | Optical member, pressure-sensitive adhesive composition and liquid crystal display | Se Woo Yang, Ki Seok Jang, Yong Su Park, Min Soo Park, Jong Rok JEON | 2018-11-20 |
| 10125292 | Adhesive film and product for encapsulating organic electronic device using same | Seung Min Lee, Hyun Jee Yoo, Jung Sup Shim, Yoon Gyung Cho, Kyung Yul Bae | 2018-11-13 |
| 10115951 | Swelling tape for filling gap | Ji Young Hwang, Byung Kyu Jung, Yoon Tae Hwang, Se Woo Yang, Sung Jong Kim +2 more | 2018-10-30 |
| 10103353 | Encapsulation film and organic electronic device comprising the same | Yoon Gyung Cho, Hyun Jee Yoo, Kyung Yul Bae, Jung-Hyoung Lee, Jun Rye Choi | 2018-10-16 |
| 10103352 | Organic electronic device having dimension tolerance between encapsulating layer and metal-containing layer less than or equal to 200 microns | Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Jung Ok Moon | 2018-10-16 |
| 10093785 | Adhesive film and sealing product for organic electronic device using same | Seung Min Lee, Hyun Jee Yoo, Jung Sup Shim, Yoon Gyung Cho, Kyung Yul Bae | 2018-10-09 |
| 10062855 | Adhesive and method of encapsulating organic electronic device using the same | Hyun Jee Yoo, Yoon Gyung Cho, Jung Sup Shim, Suk Chin Lee, Kwang-Jin Jeong | 2018-08-28 |
| 10050204 | Encapsulation composition (as amended) | Seung Min Lee, Min Soo Park, Hyun Jee Yoo, Jung Sup Shim, Yoon Gyung Cho +3 more | 2018-08-14 |
| 10023772 | Pressure sensitive adhesive composition | Yong Su Park, Se Woo Yang, Min Soo Park, Eun Suk Park | 2018-07-17 |
| 9966562 | Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same | Yoon Gyung Cho, Hyun Jee Yoo, Jung Sup Shim | 2018-05-08 |
| 9923169 | Encapsulant film | Hyun Jee Yoo, Seung Min Lee, Yoon Gyung Cho, Kyung Yul Bae, Jung Sup Shim +4 more | 2018-03-20 |
| 9905450 | Wafer processing base | Se Ra Kim, Hyo Sook Joo, Jung Sup Shim | 2018-02-27 |
| 9868881 | Swelling tape for filling gap | Se Ra Kim, Byung Kyu Jung, Yoon Tae Hwang, Cha Hun Ku, Sung Jong Kim +3 more | 2018-01-16 |
| 9862864 | Swelling tape for filling gap | Se Ra Kim, Byung Kyu Jung, Yoon Tae Hwang, Cha Hun Ku, Sung Jong Kim +3 more | 2018-01-09 |
| 9856403 | Method of preparing pressure-sensitive adhesive product | Jong Rok JEON, Se Woo Yang, Joon-Hyung Kim, Yong-Sung Goo | 2018-01-02 |