Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953945 | Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductors | Hee Jung Kim, Jung Hak Kim, Se Ra Kim | 2018-04-24 |
| 9880467 | Photo-curable and thermo-curable resin composition and dry film solder resist | Min Su Jeong, Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi | 2018-01-30 |
| 9865480 | Printed circuit board including under-fill dam and fabrication method thereof | Byung Ju Choi, Woo Jae Jeong, Bo Yun Choi, Min Su Jeong | 2018-01-09 |