Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134679 | Printed circuit board, package substrate comprising same, and method for manufacturing same | Dong Sun Kim, Ji Haeng Lee | 2018-11-20 |
| 10062623 | Semiconductor package substrate, package system using the same and method for manufacturing thereof | Dong Sun Kim, Seung Yul Shin | 2018-08-28 |
| 9867296 | Printed circuit board and package substrate | Dong Sun Kim, Hyun Seok Seo, Ji Haeng Lee | 2018-01-09 |