Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062623 | Semiconductor package substrate, package system using the same and method for manufacturing thereof | Sung Wuk Ryu, Dong Sun Kim | 2018-08-28 |
| 9942985 | Printed circuit board and method of fabricating the same | Jae-Hwa Kim, Chung Sik Park, Chul Hwan Choi | 2018-04-10 |