Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134679 | Printed circuit board, package substrate comprising same, and method for manufacturing same | Dong Sun Kim, Sung Wuk Ryu | 2018-11-20 |
| 9867296 | Printed circuit board and package substrate | Dong Sun Kim, Sung Wuk Ryu, Hyun Seok Seo | 2018-01-09 |