JS

Jaydeep Sinha

KL Kla-Tencor: 3 patents #38 of 353Top 15%
Overall (2018): #72,189 of 503,207Top 15%
3
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
10036964 Prediction based chucking and lithography control optimization Bin-Ming Benjamin Tsai, Oreste Donzella, Pradeep Vukkadala 2018-07-31
10025894 System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking Pradeep Vukkadala, Sathish Veeraraghavan, Haiguang Chen, Michael D. Kirk 2018-07-17
9865047 Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool Haiguang Chen, Enrique Chavez, Sathish Veeraraghavan 2018-01-09