Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109553 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2018-10-23 |
| 10068827 | Integrated circuit heat dissipation using nanostructures | Alan B. Botula, Max L. Lifson, Theodore G. van Kessel, Randy L. Wolf | 2018-09-04 |
| 9978849 | SOI-MOSFET gate insulation layer with different thickness | Michel J. Abou-Khalil, Alan B. Botula, Blaine J. Gross, Mark D. Jaffe, Alvin J. Joseph +2 more | 2018-05-22 |