Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10025894 | System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking | Pradeep Vukkadala, Sathish Veeraraghavan, Jaydeep Sinha, Michael D. Kirk | 2018-07-17 |
| 9865047 | Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool | Jaydeep Sinha, Enrique Chavez, Sathish Veeraraghavan | 2018-01-09 |