Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10040219 | Mold and mold manufacturing method | Yoko Takekawa, Ryouichi Inanami, Masafumi Asano, Kazuhiro Takahata, Sachiko Kobayashi +3 more | 2018-08-07 |
| 9977855 | Method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device | Chikaaki Kodama, Koichi Nakayama, Toshiya Kotani, Fumiharu Nakajima, Hirotaka Ichikawa | 2018-05-22 |
| 9953126 | Method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device | Chikaaki Kodama, Koichi Nakayama, Toshiya Kotani, Fumiharu Nakajima, Hirotaka Ichikawa | 2018-04-24 |