Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128207 | Semiconductor packages with pillar and bump structures | Yun Liu, Jerome Teysseyre | 2018-11-13 |
| 10115842 | Semiconductor optical package and method | David Lawson, Colin Campbell, Anandan Ramasamy | 2018-10-30 |
| 9991409 | Wafer level packaging, optical detection sensor and method of forming same | Wee Chin Judy Lim | 2018-06-05 |