Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128207 | Semiconductor packages with pillar and bump structures | Yun Liu, Yonggang Jin | 2018-11-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128207 | Semiconductor packages with pillar and bump structures | Yun Liu, Yonggang Jin | 2018-11-13 |