Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997554 | Chip scale package camera module with glass interposer having lateral conductive traces between a first and second glass layer and method for making the same | Jean-Michel Grebet | 2018-06-12 |
| 9991409 | Wafer level packaging, optical detection sensor and method of forming same | Yonggang Jin | 2018-06-05 |