Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984968 | Semiconductor package and related methods | Yusheng LIN, George Chang | 2018-05-29 |
| 9941257 | Embedded stacked die packages and related methods | Yusheng LIN, Francis J. Carney, Chee Hiong CHEW, Azhar Aripin | 2018-04-10 |