Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9929075 | Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity | Tae Kyung Hwang, Eun Sook Sohn, Gi Jeong Kim | 2018-03-27 |