Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10144634 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Seung Jae Yoo, Yung Woo Lee +2 more | 2018-12-04 |
| 10032705 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, KooWoong Jeong +5 more | 2018-07-24 |