Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10135162 | Method for fabricating a hybrid land grid array connector | Jose A. Hejase, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman | 2018-11-20 |
| 10128593 | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body | Jose A. Hejase, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman | 2018-11-13 |