Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141623 | Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board | Samuel R. Connor, Joseph Kuczynski, Joshua C. Myers, Junyan Tang | 2018-11-27 |
| 10135162 | Method for fabricating a hybrid land grid array connector | Wiren D. Becker, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman | 2018-11-20 |
| 10128593 | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body | Wiren D. Becker, Daniel M. Dreps, Sungjun Chun, Brian S. Beaman | 2018-11-13 |
| 9893400 | Method for performing frequency band splitting | Rubina F. Ahmed, Daniel M. Dreps, James D. Jordan, Nam H. Pham, Lloyd A. Walls | 2018-02-13 |