SC

Sungjun Chun

IBM: 8 patents #595 of 10,623Top 6%
Overall (2018): #9,696 of 503,207Top 2%
8
Patents 2018

Issued Patents 2018

Patent #TitleCo-InventorsDate
10135162 Method for fabricating a hybrid land grid array connector Jose A. Hejase, Wiren D. Becker, Daniel M. Dreps, Brian S. Beaman 2018-11-20
10128593 Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body Jose A. Hejase, Wiren D. Becker, Daniel M. Dreps, Brian S. Beaman 2018-11-13
9980382 Method of making a printed circuit board copper plane repair Mahesh Bohra, Jesus Montanez, Daniel I. Rodriguez 2018-05-22
9955567 Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures Jinwoo Choi, Jason L. Frankel, Paul R. Walling, Roger D. Weekly 2018-04-24
9940426 Signal via positioning in a multi-layer circuit board Matteo Cocchini, Michael A. Cracraft 2018-04-10
9916410 Signal via positioning in a multi-layer circuit board Matteo Cocchini, Michael A. Cracraft 2018-03-13
9881115 Signal via positioning in a multi-layer circuit board using a genetic via placement solver Matteo Cocchini, Michael A. Cracraft 2018-01-30
9875331 Signal via positioning in a multi-layer circuit board using a genetic via placement solver Matteo Cocchini, Michael A. Cracraft 2018-01-23