Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10082390 | Feed-forward of multi-layer and multi-process information using XPS and XRF technologies | Heath A. Pois, Lawrence V. Bot, Michael Kwan, Mark Klare, Charles Thomas Larson | 2018-09-25 |
| 9952166 | Silicon germanium thickness and composition determination using combined XPS and XRF technologies | Heath A. Pois | 2018-04-24 |
| 9926639 | Methods for forming barrier/seed layers for copper interconnect structures | Hoon Kim, Sang Ho Yu, Seshadri Ganguli, Hyoung-Chan Ha, Sang-Hyeob Lee | 2018-03-27 |