Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128205 | Embedded die flip-chip package assembly | Thorsten Meyer | 2018-11-13 |
| 10121726 | Cooler for semiconductor devices | Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler, Alexandra Atzesdorfer +1 more | 2018-11-06 |
| 10115668 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Christian Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2018-10-30 |
| 9997444 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Gerald Ofner, Andreas Wolter, Georg Seidemann, Christian Geissler | 2018-06-12 |
| 9985005 | Chip package-in-package | Thorsten Meyer, Andreas Wolter | 2018-05-29 |
| 9921694 | Wearable computing device | Klaus Reingruber, Teodora Ossiander, Andreas Wolter, Sonja Koller, Georg Seidemann +3 more | 2018-03-20 |
| 9888577 | Passive electrical devices with a polymer carrier | Thorsten Meyer, Gerald Ofner, Reinhard Mahnkopf | 2018-02-06 |
| 9865387 | Electronic package with coil formed on core | Klaus Reingruber, Andreas Wolter | 2018-01-09 |