Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157869 | Integrated circuit package | Thorsten Meyer, Gerald Ofner, Teodora Ossiander, Frank Zudock | 2018-12-18 |
| 10150668 | Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) | Gerald Ofner, Thorsten Meyer, Reinhard Mahnkopf, Andreas Augustin | 2018-12-11 |
| 10121726 | Cooler for semiconductor devices | Sven Albers, Klaus Reingruber, Andreas Wolter, Georg Seidemann, Alexandra Atzesdorfer +1 more | 2018-11-06 |
| 10115668 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more | 2018-10-30 |
| 9997444 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Gerald Ofner, Andreas Wolter, Georg Seidemann, Sven Albers | 2018-06-12 |
| 9856136 | Chip arrangement and method for manufacturing a chip arrangement | Thorsten Meyer, Gerald Ofner, Christian Mueller, Reinhard Mahnkopf, Andreas Augustin | 2018-01-02 |