| 10128205 |
Embedded die flip-chip package assembly |
Thorsten Meyer |
2018-11-13 |
| 10121726 |
Cooler for semiconductor devices |
Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler, Alexandra Atzesdorfer +1 more |
2018-11-06 |
| 10115668 |
Semiconductor package having a variable redistribution layer thickness |
Klaus Reingruber, Christian Geissler, Georg Seidemann, Bernd Waidhas, Thomas Wagner +1 more |
2018-10-30 |
| 9997444 |
Microelectronic package having a passive microelectronic device disposed within a package body |
Thorsten Meyer, Gerald Ofner, Andreas Wolter, Georg Seidemann, Christian Geissler |
2018-06-12 |
| 9985005 |
Chip package-in-package |
Thorsten Meyer, Andreas Wolter |
2018-05-29 |
| 9921694 |
Wearable computing device |
Klaus Reingruber, Teodora Ossiander, Andreas Wolter, Sonja Koller, Georg Seidemann +3 more |
2018-03-20 |
| 9888577 |
Passive electrical devices with a polymer carrier |
Thorsten Meyer, Gerald Ofner, Reinhard Mahnkopf |
2018-02-06 |
| 9865387 |
Electronic package with coil formed on core |
Klaus Reingruber, Andreas Wolter |
2018-01-09 |