Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083919 | Packaging for high speed chip to chip communication | — | 2018-09-25 |
| 10083886 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2018-09-25 |
| 10056268 | Limiting electronic package warpage | — | 2018-08-21 |
| 10049896 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2018-08-14 |
| 9953935 | Packaging for high speed chip to chip communication | — | 2018-04-24 |
| 9947603 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Kamal K. Sikka, Hilton T. Toy, Jeffrey A. Zitz | 2018-04-17 |
| 9892935 | Limiting electronic package warpage with semiconductor chip lid and lid-ring | — | 2018-02-13 |