Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10130302 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Jae-Woong Nah | 2018-11-20 |
| 9861313 | Via and trench filling using injection molded soldering | John U. Knickerbocker, Jae-Woong Nah | 2018-01-09 |