Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074583 | Circuit module and manufacturing method thereof | Akihiro Horibe, Kuniaki Sueoka | 2018-09-11 |
| 9967971 | Method of reducing warpage of an orgacnic substrate | Hiroyuki Mori, Keishi Okamoto | 2018-05-08 |