Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083891 | Memory having thermoelectric heat pump and related IC chip package and method | Sebastian T. Ventrone, Ezra D. B. Hall | 2018-09-25 |
| 10043962 | Thermoelectric cooling using through-silicon vias | Sudeep Mandal | 2018-08-07 |
| 9972606 | Three-dimensional hybrid packaging with through-silicon-vias and tape-automated-bonding | Sebastian T. Ventrone | 2018-05-15 |
| 9941458 | Integrated circuit cooling using embedded peltier micro-vias in substrate | Jeffrey P. Gambino, Sudeep Mandal | 2018-04-10 |
| 9913405 | Glass interposer with embedded thermoelectric devices | Jeffrey P. Gambino, Sudeep Mandal, David J. Russell | 2018-03-06 |
| 9892999 | Producing wafer level packaging using leadframe strip and related device | Sudeep Mandal, Kibby B. Horsford | 2018-02-13 |
| 9882369 | Multi-layer heat shrinkable tubular sleeve | David Pearce, Thomas Rohde, John David Stoker, Timothy Stephen Smith | 2018-01-30 |
| 9870851 | Low temperature fabrication of lateral thin film varistor | Jeffrey P. Gambino, Sudeep Mandal | 2018-01-16 |
| 9865674 | Low temperature fabrication of lateral thin film varistor | Jeffrey P. Gambino, Sudeep Mandal | 2018-01-09 |