Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083891 | Memory having thermoelectric heat pump and related IC chip package and method | Richard S. Graf, Ezra D. B. Hall | 2018-09-25 |
| 9972606 | Three-dimensional hybrid packaging with through-silicon-vias and tape-automated-bonding | Richard S. Graf | 2018-05-15 |
| 9871020 | Through silicon via sharing in a 3D integrated circuit | Sudeep Mandal | 2018-01-16 |