Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163871 | Integrated device comprising embedded package on package (PoP) device | Rajneesh Kumar, Chin-Kwan Kim | 2018-12-25 |
| 10037941 | Integrated device package comprising photo sensitive fill between a substrate and a die | Vladimir Noveski, Rajneesh Kumar | 2018-07-31 |