Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037941 | Integrated device package comprising photo sensitive fill between a substrate and a die | Milind Shah, Rajneesh Kumar | 2018-07-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037941 | Integrated device package comprising photo sensitive fill between a substrate and a die | Milind Shah, Rajneesh Kumar | 2018-07-31 |