Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163871 | Integrated device comprising embedded package on package (PoP) device | Chin-Kwan Kim, Milind Shah | 2018-12-25 |
| 10073594 | Disk utilization analysis | Vishal Anand, Sahadev Dey, Vijay S. Patil, Amit Patra | 2018-09-11 |
| 10037941 | Integrated device package comprising photo sensitive fill between a substrate and a die | Vladimir Noveski, Milind Shah | 2018-07-31 |
| 9947642 | Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages | Chin-Kwan Kim, Brian Roggeman | 2018-04-17 |