Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043736 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2018-08-07 |