Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141249 | Molded intelligent power module and method of making the same | Zhiqiang Niu, Bum Seok Suh, Wonjin Cho | 2018-11-27 |
| 10043736 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2018-08-07 |
| 9929076 | Semiconductor package of a flipped MOSFET chip and a multi-based die paddle with top surface groove-divided multiple connecting areas for connection to the flipped MOSFET electrodes | Yan Xun Xue, Yueh-Se Ho, Hamza Yilmaz | 2018-03-27 |