Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141249 | Molded intelligent power module and method of making the same | Bum Seok Suh, Wonjin Cho, Jun Lu | 2018-11-27 |
| 10056893 | Molded power module having single in-line leads | Bum Seok Suh, Wonjin Cho, Son Tran, James Rachana Bou | 2018-08-21 |
| 10043736 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2018-08-07 |
| 9966328 | Semiconductor power device having single in-line lead module and method of making the same | Yan Xun Xue | 2018-05-08 |
| 9881856 | Molded intelligent power module | Bum Seok Suh, Wonjin Cho, Cheow Khoon Oh, Son Tran, James Rachana Bou | 2018-01-30 |