Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10025894 | System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking | Pradeep Vukkadala, Sathish Veeraraghavan, Jaydeep Sinha, Haiguang Chen | 2018-07-17 |