Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9984898 | Substrate, semiconductor package including the same, and method for manufacturing the same | Chih-Cheng Lee, Cheng-Lin Ho | 2018-05-29 |
| 9966333 | Semiconductor substrate, semiconductor module and method for manufacturing the same | Chih-Cheng Lee | 2018-05-08 |
| 9887167 | Embedded component package structure and method of manufacturing the same | Chih-Cheng Lee, Hsing Kuo Tien | 2018-02-06 |