Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103054 | Coupled vias for channel cross-talk reduction | Zhichao Zhang, Zhiguo Qian, Tolga Memioglu | 2018-10-16 |
| 10056528 | Interposer structures, semiconductor assembly and methods for forming interposer structures | Zhiguo Qian | 2018-08-21 |
| 10026682 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2018-07-17 |
| 9971089 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Zhichao Zhang, Robert L. Sankman | 2018-05-15 |
| 9935063 | Rlink-on-die inductor structures to improve signaling | Yu Zhang, Jihwan Kim, Ajay Balankutty, Anupriya Sriramulu, Md. Mohiuddin Mazumder +2 more | 2018-04-03 |
| 9922751 | Helically insulated twinax cable systems and methods | Zhichao Zhang, Gong Ouyang, Kai Xiao, Eric J. Li | 2018-03-20 |
| 9894752 | Inductors for circuit board through hole structures | Zhichao Zhang, Gong Ouyang, Kai Xiao, Beom-Taek Lee | 2018-02-13 |