Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9926639 | Methods for forming barrier/seed layers for copper interconnect structures | Wei Ti Lee, Sang Ho Yu, Seshadri Ganguli, Hyoung-Chan Ha, Sang-Hyeob Lee | 2018-03-27 |
HK
Hoon Kim
Overall (2018): #395,317 of 503,207Top 80%
1
Patents 2018