Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090280 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2018-10-02 |
| 10032752 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2018-07-24 |