Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043707 | Additive conductor redistribution layer (ACRL) | John August Orlowski | 2018-08-07 |
| 10020206 | Encapsulated dies with enhanced thermal performance | Thomas Scott Morris, Stephen Parker, Jon Chadwick, Julio C. Costa | 2018-07-10 |
| 9960145 | Flip chip module with enhanced properties | Julio C. Costa, Thomas Scott Morris, Jonathan Hale Hammond, Stephen Parker, Jon Chadwick | 2018-05-01 |