Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062649 | Package substrate | Shih-Ping Hsu | 2018-08-28 |
| 10002823 | Packaging substrate and method of fabricating the same | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu | 2018-06-19 |