Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163812 | Device having substrate with conductive pillars | Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Valentyn Solomko | 2018-12-25 |
| 10109592 | Semiconductor chip with electrically conducting layer | — | 2018-10-23 |
| 9868632 | Molded cavity package with embedded conductive layer and enhanced sealing | Chau Fatt Chiang, Kok Yau Chua, Swee Kah Lee, Horst Theuss | 2018-01-16 |