Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163812 | Device having substrate with conductive pillars | Chau Fatt Chiang, Swee Kah Lee, Chee Yang Ng, Valentyn Solomko | 2018-12-25 |
| 10155657 | Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening | Matthias Steiert, Chu Hua Goh, Woon Yau Lim, Christina Yeong | 2018-12-18 |
| 9868632 | Molded cavity package with embedded conductive layer and enhanced sealing | Chau Fatt Chiang, Swee Kah Lee, Chee Yang Ng, Horst Theuss | 2018-01-16 |