Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155657 | Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening | Matthias Steiert, Kok Yau Chua, Chu Hua Goh, Woon Yau Lim | 2018-12-18 |