| 10103624 |
Thermal sensor circuit |
Re-Ching Lin, Fan Huang, Tung-Yao Chou, Shu-Hsiao Tsai, Chih-Feng Chiang |
2018-10-16 |
| 10096583 |
Method for fabricating a semiconductor integrated chip |
Shinichiro Takatani, Hsien-Fu Hsiao, Chang-Hwang Hua |
2018-10-09 |
| 9998087 |
Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device |
Shu-Hsiao Tsai, Re-Ching Lin, Pei-Chun Liao, Yung-Chung Chin |
2018-06-12 |
| 9991198 |
Layout method for compound semiconductor integrated circuits |
Shu-Hsiao Tsai, Rong-Hao Syu, Yi-Ling Liu |
2018-06-05 |
| 9911837 |
Heterojunction bipolar transistor |
Jui-Pin Chiu, Shu-Hsiao Tsai, Rong-Hao Syu |
2018-03-06 |
| 9905610 |
Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereof |
Shu-Hsiao Tsai, Re-Ching Lin, Pei-Chun Liao, Yung-Chung Chin, Chih-Feng Chiang |
2018-02-27 |