Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10158212 | Structure for reducing compound semiconductor wafer distortion | Wen Chu | 2018-12-18 |
| 10096583 | Method for fabricating a semiconductor integrated chip | Shinichiro Takatani, Hsien-Fu Hsiao, Cheng-Kuo Lin | 2018-10-09 |