Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103624 | Thermal sensor circuit | Re-Ching Lin, Tung-Yao Chou, Cheng-Kuo Lin, Shu-Hsiao Tsai, Chih-Feng Chiang | 2018-10-16 |
| 10045289 | Method and apparatus for controlling enabling of station | Hongcheng Zhuang | 2018-08-07 |
| 10037945 | Package structure and three dimensional package structure | Chih-Wen Huang, Jui-Chieh Chiu | 2018-07-31 |