Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002840 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari | 2018-06-19 |
| 9966347 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Jaspreet S. Gandhi, Satish Yeldandi | 2018-05-08 |